Thursday, Oct 5

 




8:00 AM 8:30 AM Registration / breakfast  
8:30 AM   New developments, trends and plans (P. O'Connor)  
8:30 AM 8:40 AM Introduction P. O'Connor
8:40 AM 9:00 AM Digital-on-top Mixed Signal Design M. Horowitz
9:00 AM 9:20 AM Trends in pixel readout chip designs for high rate and radiation M. Garcia-Sciveres
9:20 AM 9:40 AM Precision Timing in HEP experiments G. Varner
9:40 AM 10:00 AM Front-end in extreme conditions  S. Li
10:00 AM 10:20 AM Rad-hard methodology and cad tools S. Miryala
10:20 AM 10:40 AM Coffe Break  
10:40 AM 11:00 AM Advanced Interconnections between Sensors and Integrated Circuits C. Kenney
11:00 AM 11:20 AM 3D-IC status and trends  R. Lipton
11:20 AM 11:40 AM Content addressable memories for HEP  T. Liu
11:40 AM 12:00 PM Information-centric analog interfaces  B. Murmann
12:00 PM 1:00 PM Lunch Break / Poster Session  
1:00 PM 1:20 PM Cadence: trends in CAD tools and services M. Nizic
1:20 PM 1:40 PM MOSIS technology Roadmap R. Pina
1:40 PM 2:40 PM Roundtable  
2:40 PM 3:00 PM Coffe Break  
3:00 PM   Collaborations and partnership with other research agencies and industry  (A. Dragone)  
3:00 PM 3:10 PM Introduction (Advantages for HEP from synergies with industry) A. Dragone
3:10 PM 3:30 PM Working with National Labs M. Willardson
3:30 PM 4:30 PM Roundtable  
       
6:00 PM   Social Dinner  
    Left Bank - 635 Santa Cruz Av. Menlo Park